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PECVD Tube Furnace Systems

PECVD tube furnace systems coordinated around plasma generation, reaction-zone heating, gas delivery, pressure control, tube interfaces, exhaust and automation.

PECVD tube furnace system with split heated chamber, gas controls and vacuum components

Configuration overview

Application fit
Plasma-assisted chemical vapor deposition research and process development requiring a defined thermal, gas, pressure and plasma boundary.
Temperature / cycle
Defined by the selected configuration and required working cycle. Working and maximum values must be confirmed separately.
Geometry
Process-tube geometry, plasma region, substrate holder, heated length, seals, ports and cabinet footprint require system-level review.
Atmosphere boundary
Process gases, flow control, operating pressure, pumping, purge, exhaust and compatible sealing materials must be defined before configuration.
Heating / connection
Split-furnace geometry, zone arrangement, element layout and temperature measurement are coordinated with the plasma and substrate region.

Add the plasma boundary to the complete CVD system

PECVD equipment includes the thermal, gas, pressure and exhaust decisions of a CVD system, with an additional plasma-generation and coupling boundary. The plasma region, process tube, substrate position and heated zone must be coordinated rather than treated as independent accessories.

Plasma regionRequired treatment or deposition region, coupling arrangement and substrate position.
Thermal regionWorking cycle, heated length, split-chamber geometry, zones and sensors.
Gas and pressureProcess gases, flow, pressure objective, pumping, purge and exhaust.
Control and safetySequence, interlocks, alarms, data and facility responsibilities.

Coordinate the split furnace and process tube

A split furnace can provide access around an installed tube, but bore, heated length, opening direction, tube support and insulation interfaces must match the complete assembly. The chamber image documents the element and insulation arrangement; final dimensions and electrical values remain configuration-specific.

Specify the plasma subsystem clearly

State the required plasma source or coupling approach, intended plasma region and relationship to substrate heating. If an RF generator, matching network, electrodes or other plasma hardware is expected inside the scope, identify the required interfaces and sequence.

Plan maintenance and process cleaning

Deposition equipment must provide practical access to tubes, seals, holders and contaminated process components. Describe cleaning frequency, removable parts, residue concerns and any restrictions on handling or exhaust.

Prepare the technical discussion

  • Process objective, substrate and holder geometry
  • Required plasma region and source boundary
  • Tube material, diameter, length and sealing
  • Working temperature, zones and substrate position
  • Process and purge gases with available safety information
  • Pressure, pumping and exhaust treatment
  • Automation, interlocks, data, utilities and destination country